3 1/2" Embedded SBC's and Chassis
IEI Wafer Series
Boards based on Intel Pentium M, Celeron M, Atom N270, Z510P/530P, AMD LX800 and Geode GX466.
Wafer-GSE |
|
|
| ||
Wafer-GSE2 | 3.5" SBC with Intel® Atom™ N270 1.6G, VGA/LVDS, Dual GbE,CFII, USB, SATA, on board 1GB Memory and PC/104 |
|
| ||
Wafer-GSE3 | 3.5" SBC with Intel® Atom™ N270 1.6G, VGA/LVDS/TTL, GbE,CFII, USB, SATA, LPT, 4COM and PC/104 |
|
| ||
Wafer-GSELVDS2 | 3.5" SBC with Intel® Atom™ N270 1.6G, 18 bit and 24 bit dual Channel LVDS, LAN GbE, CFII, USB,, COM, SATA, on board 1GB Memory |
|
| ||
WAFER-PVD4253/N4553/D5253 | 3.5" SBC with Intel® Atom™ D425/N455/D525, DDR3, VGA/18-bit+48-bit LVDS, GbE, USB 2.0 and SATA 3Gb/s, Audio, RoHS |
|
| ||
Wafer-PV-D5252/N4552/D4252 | 3.5" SBC with Intel® Atom™ D425/N455/D525, DDR3, VGA/LVDS, Dual GbE, USB 2.0 and SATA 3Gb/s, Audio, RoHS |
|
| ||
Wafer-PV-D5251,N4551,D4251 | 3.5” SBC with Intel® Atom™ D425/N455/D525, DDR3 1GB memory on board, VGA/LVDS, Dual GbE, USB 2.0, SATA 3Gb/s |
|
| ||
Wafer-LX-R12 | 3.5” SBC with AMD® Geode LX800 Processor, DDR 400, VGA/LVDS/TTL Display Interfaces, Dual LAN, 2 x SATA, 3 x COM, 4 x USB 2.0 CF Card Interface, PC/104 Interface & Windows XP Embedded OS Support |
|
| ||
Wafer-LX2-R11 | 3.5” SBC with AMD® Geode LX800 Processor, 8 x COM, DDR 400, VGA/LVDS/TTL Display Interfaces, 4 x USB 2.0, CF Card Interface, PC/104 Interface & Windows XP Embedded OS Support |
|
| ||
Wafer-LX3-R10 | 3.5” SBC with AMD Geode LX800 SBC, VGA/LVDS/TTL Display Interfaces, 3 x COM, 4 x USB 2.0, Dual LAN, Audio, CF Card Interface, PC/104 Interface & Windows XP Embedded OS Support, Operating Temperature 0-60°C,- 20 to +80 °C for WAFER-LX3-800. |
|
| ||
Wafer-US15WP | 3.5" SBC with Intel® Atom™ Z510P 1,1 GHz or Z530P 1.6GHz, VGA/24 bit LVDS, GbE,CFII, USB, Audio |
|
| ||
Wafer-US15WP2 | 3.5" SBC with 1.6GHz, VGA/24 bit dual LVDS, GbE,CFII,6 x USB,4 x COM, Audio,Intel® Atom™ Z510P 1,1 GHz or Z530P, on Heatsink
|
|
| ||
Wafer-9102 | 3.5" SBC, Socket 479 Intel® Pentium® M / Celeron® M CPU, VGA/LVDS, LAN, USB 2.0 and Audio, |
|
| ||
Wafer-8522 | 3.5" SBC with ULV Intel Celeron M CPU with VGA/ LVDS, Dual PCIe GbE, 6 x COM, USB 2.0 and Audio, CF Card Interface, PC/104 Interface, Enclosure Heatsink |
|
|
IEI Universal Chassis for 3,5" SBC's:
ECB-1000G | Chassis for Wafer: LX2, 6612, VIA-Luke, VIA-Mark, LX, GX. Power Supplies with 90 Watts are available. Inputs: AC, 12,24,48,100 VDC. 2,5" HDD Drive Bay, 4cm Fan. |
| ||
ECW-180B/181B | 3,5 " SBC Chassis: Fanless solutions for AMD® and VIA® Processors, Quiet operation with heat pipe thermal controll, easy-accessible CF openings at the bottom, 2 x 2.5” HDD drive capacity. For Wafer-LX, GX. |
|
| |
ECW-180A/181A | 3,5 " SBC Chassis: Celeron M, VIA, AMD soultions available, 2 x 5cm cooling fans, 2 x 2.5” HDD drive capacity.For Wafer-LX, GX, 6612. |
|
| |
ECW-181BLX2-WD | 3,5 " SBC Chassis: Fanless, Built-in DC-to-DC power converter (9-36 VDC Input), AMD LX800 CPU solutions, 2,5" Hard Disk Bay. For Wafer-LX2 with AMD LX800, 500 MHz CPU and 7 RS232. VESA 75, Wall or DIN-Rail mount. |
|
| |
ECW-281B-8522 | 3,5 " SBC Chassis: Fanless, optional DC-to-DC power converter (9-36 VDC Input), For Wafer-8522. Intel Celeron M 1 GHz with and without Cache based CPU Board, 5 x RS232 and one RS232/422/485. VESA 100 or DIN rail mount. |
|
| |
ECW-281B-ATOM | 3,5" Wafer-ATOM based fanless Solution. ATOM N270, 1,6 GHz CPU, 4 x USB, 5 x RS232, 1x RS232/422/485, 2 x GbE LAN, 2,5" HDD drive bay, case 132x229x64 mm, operating temperature -10-50°C, 12 VDC or 9-36 VDC input. |
|
|
Copyright © 1997-2012 MPI Distribution AG, a member of the HT Holding AG.
Information contained in this document is subject to change without notice.
Other products and companies referred to herein are trademarks or registered trademarks of their respective companies or mark holders.