Low-power, high-performance, wide-temperature COM Express computer-on-modules.

These compact, low-power, and powerful COM Express modules are suitable for powering a wide range of embedded applications. Additionally, to support real-world applications subject to temperature extremes these modules are rated for operation over enhanced (-20 to +71 deg. C) and extended (-40 to +85 deg. C) temperature ranges.

Each Diamond COM Express module integrates a complete set of PC-compatible functions, including a low-power, high-performance Intel processor and from 1GB to 4GB of soldered-on or SO-DIMM system memory. In addition, the modules provides interface controllers for high-resolution displays, gigabit Ethernet, and SATA storage devices, as well as multiple USB 2.0, parallel, digital I/O, and audio ports.

By plugging these powerful, plug-and-play COMs into standard or custom application baseboards, OEMs can reduce development costs, minimize design risks, and shorten time-to-revenue while benefiting from the latest embedded technologies. The CME-Atom and CME-965 also come pre-integrated in our Magellan Embedded-Ready Subsystem.

Datasheet Magellan Base Board:

Manual Magellan Base Board:

Magellan Expansion:

FeaturePak Modules for Mageellan:

COM Module:

CME-965	COM Express module with Intel 1.6GHz Core 2 Duo LV CPU, two SO-DIMM sockets with 0GB RAM	Datasheet Manual
CME-Z510-1G	CME-Atom COM with Intel 1.1GHz Intel Atom Z510PT CPU, 1GB SDRAM on-board	Datasheet Manual