DSM Galaxy® G6
Technical Specifications |
|||
| CPU: | with Intel® Core™ 2 Duo T7400 2.16 GHz CPU and cooler fan (opt. with Intel® Core™ Duo T2500, 2.0 GHz) |
||
| FSB: | 533 and 667 MHz | ||
| RAM: | up to 4 GB DDR2 RAM (max. 3 GB for OS), 667 MHz, 0 MB equipded | ||
| Chipset: | Intel® 82945GM | ||
| BIOS: | Award System BIOS in Flash-ROM with Graphic, LAN BIOS | ||
| LAN: | Intel® ICH-7M Ethernet controller, 10 Base T / 100 Base
TX support, full duplex, RJ45 port |
||
| WLAN: | opt. Wireless LAN 802.11b/g | ||
| GigabitLAN: | Marvell Yukon 88E8053 Ethernet controller, 10/100/1000 Base-T/TX
support, full duplex, 1 x RJ45 port, PCIe |
||
| FireWire: | IEEE 1394 TI TSB43LV22 two port FireWire (1 x ext., 1 x int.) | ||
| Graphic: | Intel® Graphic Media Accelerator 950 VGA, max. resolution:
2048 x 1536 @ 75 Hz, Intel® Dynamic Video Memory Technology, S-VIDEO and Composite TV-Out |
||
| Audio: | Realtek ALC655 Audio Controller, AC"97, S/PDIF, Line-Out, Line-In and Mic | ||
| Serial ATA: | for 2 SATA 150 drives | ||
| IDE: | supports 2 enhanced IDE drives, Ultra DMA/33/66/100 | ||
| Compact-Flash: | internal Compact Flash Socket | ||
| Serial: | two serial ports (RS232, 16C550 FIFO compatible) | ||
| USB: | 6x USB 2.0 | ||
| PS2: | 2 x PS/2 port | ||
| Mini-PCI: | 1 x Mini-PCI slot (internal), Type IIIA | ||
| Drives: | 1 x 3.5" drive bay alternatively for: - Floppy-Disk Drive - 1 x 3.5" HDD (EIDE o. SATA 150) - 2 x 2.5" HDD (EIDE o. SATA 150) - 1 x Compact Flash |
||
| PCI: | 4 x PCI or 3 x PCI and 1 x PCI Express x1 expansion slot for half-size cards | ||
| Case: | Solid, high-quality industrial case | ||
| Power Supply: | incl. internal 180 Watt power supply, 100-240 Volt AC opt. 24 Volt DC, 200 Watt |
||
| Mounting Rails: | incl. mounting rails | ||
| Cooler Fans: | wo 8 cm cooler fan for system, temp. controlled | ||
| Dimensions: | 149 x 260 x 280 mm (W/D/H) | ||
| Environment: | Operating Temperatures: 0° ~ 50°C | ||
Copyright © 1997-2012 MPI Distribution AG, a member of the HT Holding AG.
Information contained in this document is subject to change without notice.
Other products and companies referred to herein are trademarks or registered trademarks of their respective companies or mark holders.