DIN Rail PC's, Fanless
PIP from MPL
Packaged Industrial PC:
- Lowest power consumption in industry
- Embedded, fanless, compact, robust, reliable
- Extended temperature (-40°C up to +85°C)
- Shock and vibration proof
- Depopulated and/or OEM solutions (COTS)
3 Year Warranty!
13 Years PIP Concept !
ackaged Industrial PCs (PIP)Embedded Industrial Computer. The name PIP stands for a compact, robust, low power, fanless, and ready to use Industrial PC. It comes with a long term availability guarantee and fits on a DIN rail.•Low power SBC designs•Fanless solutions•Extended temperature -40°C to +75°C•Long-term availability guarantee•Expandable with PC/104, PC/104-Plus, PCI, and PMC modules•Robust flexible aluminum housingsAll MPL products are fanless and noiseless and therefore the excellent solution for critical and reliable applications.
Model Name | CPU | More Information | RoHS | |
PIP 6-11 | Z530P Intel Atom CPU |
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PIP 8-11 | Intel Celeron M, 1 GHz, 512kB L2 Cache |
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PIP 9-11 | Intel Celeron M, 1,0 GHz, FireWire, Giga-LAN, on Board SDRAM DDR 512 MB |
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PIP 9-1E | Intel Celeron M, 1,0 GHz, FireWire, 3 x Gigabit LAN, on Board SDRAM DDR 512 MB |
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PIP 10-1 | Intel Pentium M, 1,4 GHz, FireWire, Giga-LAN, on Board SDRAM DDR 512 MB |
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PIP 10-1E | Intel Pentium M, 1,4 GHz, FireWire, 3 x Giga-LAN, on Board SDRAM DDR 512 MB |
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PIP 11-1 | Intel Pentium M, 1,8 GHz, FireWire, Giga-LAN, on Board SDRAM DDR 512 MB |
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PIP 11-1E | Intel Pentium M, 1,8 GHz, FireWire, 3 x Giga-LAN, on Board SDRAM DDR 512 MB |
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PIP 15-1 | Headless Intel embedded SoC Pentium M 1.2 GHz with 256KB L2 cache, ECC DDR2 memory socket (max 4GB module), 3x GigaBit Ethernet, 2x USB 2.0, 4x RS232, PCI-104 |
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PIP 19-1 | Low Power embedded Celeron M 423 1.06GHz with 1MB L2 Cache, 1GB RAM on-board, additional DDR2 memory socket (max. 2GB module), 2x GigaBit Ethernet, 3D Graphic (DVI-I), 4x USB 2.0, FireWire, 2x RS232, PC/104.. |
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PIP 20-1 | Intel Core Duo , 1,67 GHz Processor, 2x Gigabit Ethernet, 4 serial ports, and onboard soldered 1GB memory |
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PIP 22-1 | Low Power Intel Core 2 Duo L7400, 1,5 GHz, Chip Set Intel 945 GME + ICH7-MDH |
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PIP 23-1 | Low Power Intel Core 2 Duo L7400, 2,16 GHz, Chip Set Intel 945 GME + ICH7-MDH
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PIP-31 | Low Power embedded Intel Celeron 827E 1.5GHz* with 1.5MB Cache, 2GB DDR3 on-board, additional DDR3 socket (up to 8GB), 4x GigE, 3D Graphic (DVI-I), 4x USB 3.0, 5x USB 2.0, 4x SATA, 2x RS232, PC/104... |
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PIP-38 | Low Power embedded Intel Core i7-3555LE 2.5GHz* with 4MB Cache, 4GB DDR3 on-board, additional DDR3 socket (up to 8GB), 4x GigE, 3D Graphic (DVI-I), 4x USB 3.0, 5x USB 2.0, 4x SATA, 2x RS232, PC/104... |
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Operating System Support available... !
XTEST: Extented temperature test -40 to + 75°C !
PIP Accessories/Options
More information about all the PIP accessories / options...
Exsamples:
Ein Rechner zur Ansteuerung zweier Displays...
Dual Independent Display und Display Clone...
100G Schock getesteter Embedded Computer...
100GEmbedded PC withstands 100G...
CEC-7/6/5, rugged, low Power DIN-Rail-PC
The CEC Specialities:
The name CEC stands for the ultra compact, robust, fanless, and low power Embedded Computer Family with Intel processors. The systems are offered with long term availability guarantee and in a rugged housing with different mounting options. CEC units are available according your requirements, even with your logo.
Features:
• Ultra compact systems without any wiring
• Fanless solutions for extended temperature -40°C to +85°C (-40°F to +185°F)
• Robust aluminum housings with stainless steel front plates
• Low power embedded designs
• Long-term availability guarantee
• Customized design and functionality
Model Name | CPU | More Information | RoHCEC | |
CEC7-10/11 | Z530P Intel Atom CPU, 1,6 GHz |
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CEC6-10/11 | Z520PT Intel Atom CPU, 1,1 GHz |
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CEC5-10/11 | Z510PT Intel Atom CPU, 1,1 GHz |
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CEC4-10 | RISC SoC ARM 9, 1,2 GHz |
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IEI DIN-Rail Solution
IP67 extend temperature fanless embedded system
- Ultra low voltage Intel® Atom™ Z510PT solution |
more about the WStrider-200A...
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Information contained in this document is subject to change without notice.
Other products and companies referred to herein are trademarks or registered trademarks of their respective companies or mark holders.